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(as of Jul 12, 2024 08:26:04 UTC – Details)
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition’s place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today’s most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world’s leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available.
Stay Current with the Latest Technologies
In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on…
Silicon-on-insulator (SOI) materials and devices
Supercritical CO2 in semiconductor cleaning
Low-κ dielectrics
Atomic-layer deposition
Damascene copper electroplating
Effects of terrestrial radiation on integrated circuits (ICs)
Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication.
While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
ASIN : B00OD4VGUM
Publisher : CRC Press; 2nd edition (December 19, 2017)
Publication date : December 19, 2017
Language : English
File size : 86984 KB
Simultaneous device usage : Up to 4 simultaneous devices, per publisher limits
Text-to-Speech : Not enabled
Enhanced typesetting : Not Enabled
X-Ray : Not Enabled
Word Wise : Not Enabled
Sticky notes : Not Enabled
Print length : 1720 pages
